JPH0427507B2 - - Google Patents
Info
- Publication number
- JPH0427507B2 JPH0427507B2 JP56123421A JP12342181A JPH0427507B2 JP H0427507 B2 JPH0427507 B2 JP H0427507B2 JP 56123421 A JP56123421 A JP 56123421A JP 12342181 A JP12342181 A JP 12342181A JP H0427507 B2 JPH0427507 B2 JP H0427507B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- insulating plate
- lead terminal
- spring pin
- floating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56123421A JPS5824871A (ja) | 1981-08-06 | 1981-08-06 | 半導体パッケ−ジ測定治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56123421A JPS5824871A (ja) | 1981-08-06 | 1981-08-06 | 半導体パッケ−ジ測定治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5824871A JPS5824871A (ja) | 1983-02-14 |
JPH0427507B2 true JPH0427507B2 (en]) | 1992-05-12 |
Family
ID=14860131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56123421A Granted JPS5824871A (ja) | 1981-08-06 | 1981-08-06 | 半導体パッケ−ジ測定治具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5824871A (en]) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6258780U (en]) * | 1985-09-30 | 1987-04-11 | ||
JPS6258778U (en]) * | 1985-09-30 | 1987-04-11 | ||
JPS6258779U (en]) * | 1985-09-30 | 1987-04-11 | ||
JPH0310273U (en]) * | 1989-06-15 | 1991-01-31 | ||
JPH05209933A (ja) * | 1992-01-29 | 1993-08-20 | Nec Corp | 被測定物位置出し機構付きコンタクタおよびそれを用いた自動選別装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54119667U (en]) * | 1978-02-10 | 1979-08-22 |
-
1981
- 1981-08-06 JP JP56123421A patent/JPS5824871A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5824871A (ja) | 1983-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2002164136A (ja) | Bga用icソケット | |
JPH0427507B2 (en]) | ||
JPH01113680A (ja) | 電子回路のテスト器 | |
CN218037201U (zh) | 一种芯片测试装置 | |
JP2724675B2 (ja) | Ic測定治具 | |
JPH075196A (ja) | プローブヘッドとプロービング方法 | |
JP3503798B2 (ja) | 表示パネル検査装置 | |
JP2585597B2 (ja) | 回路基板検査装置 | |
JP3267321B2 (ja) | 半導体チップソケット | |
JP2936569B2 (ja) | 選別装置 | |
JPH0745021Y2 (ja) | プローブの接点構造 | |
JPH05129386A (ja) | 半導体集積回路試験装置 | |
JPH0731185Y2 (ja) | プロービィング装置 | |
JPH0441342Y2 (en]) | ||
JPH0714927Y2 (ja) | 回路基板検査装置におけるピンボード構造 | |
JP2520823B2 (ja) | 半導体ウエハ―測定方法 | |
US6541289B2 (en) | Semiconductor-package measuring method, measuring socket, and semiconductor package | |
JP3047336B2 (ja) | 測定用ソケット | |
JPH0745020Y2 (ja) | プローブの接点構造 | |
JPH022901A (ja) | 配線基板端子ピンの長さ検査機構 | |
JP2617422B2 (ja) | ウエハープロバー及び半導体ウエハー測定方法 | |
JPH0729497Y2 (ja) | 多ピンプローブ | |
JPH074612Y2 (ja) | 測定治具 | |
JPH0747740Y2 (ja) | プローブの接点構造 | |
JPH04317349A (ja) | 集積回路装置の検査装置 |